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Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Die   Wire Bond - Au   Capacitor   Laminate Board   Solder Paste   TOTAL 
Epoxy resin
[%] 		Phenol Resin
[%] 		Metal Hydroxide
[%] 		Silica Amorphous (SiO2)
[%] 		Carbon Black (C)
[%] 		Fused Silica (SiO2)
[%] 		Weight
[mg] 		Silicon (Si)
[%] 		Weight
[mg] 		Gold (Au)
[%] 		Weight
[mg] 		Titanium Dioxide (TiO2)
[%] 		Boron Trioxide (B2O3)
[%] 		Tin (Sn)
[%] 		Silica Amorphous (SiO2)
[%] 		Misc.
[%] 		Barium Monoxide (BaO)
[%] 		Nickel (Ni)
[%] 		Copper (Cu)
[%] 		Weight
[mg] 		Tetraamminepalladium (II) dichloride
[%] 		triethylenediamine
[%] 		Sodium citrate
[%] 		D.I. Water
[%] 		Nickel Sulfamate
[%] 		copper
[%] 		copper foil
[%] 		continuous filament fiber glass
[%] 		Defoamers
[%] 		Phthalocyanine blue
[%] 		Organic Filler
[%] 		Acrylate resin
[%] 		Diproplyeneglycolmonomethylether
[%] 		Gold Potassium Cyanide
[%] 		Thermosetting resin
[%] 		Cured Thermosetting Resin
[%] 		Silica
[%] 		Talc
[%] 		3-methoxy-3-methylbutylacetate
[%] 		Naphthalene
[%] 		Photoinitiator
[%] 		Palladium (Pd)
[%] 		Nickel (Ni)
[%] 		Gold (Au)
[%] 		Solvent Naphtha (Solvent oil)
[%] 		Copper (Cu)
[%] 		Barium Sulfate (BaSO4)
[%] 		Weight
[mg] 		2-(2-Hexyloxyethoxy) ethanol
[%] 		Denatured Acid Hydrogenation Rosin
[%] 		Dimer Acid
[%] 		Silver (Ag)
[%] 		Tin (Sn)
[%] 		Copper (Cu)
[%] 		Weight
[mg] 		Weight
[mg]
proprietary data proprietary data proprietary data 7631-86-9 1333-86-4 60676-86-0 n/a 7440-21-3 n/a 7440-57-5 n/a 13463-67-7 1303-86-2 7440-31-5 7631-86-9 proprietary data 1304-28-5 7440-02-0 7440-50-8 n/a 13818-17-3 280-57-9 68-04-2 7732-18-5 13770-89-3 7440-66-6 n/a n/a n/a n/a n/a n/a 34590-97-8 13967-50-5 proprietary data proprietary data proprietary data 14807-96-6 103429-90-9 91-20-3 proprietary data 7440-05-3 7440-02-0 7440-57-5 64742-94-5 7440-50-8 7727-43-7 n/a 112-59-4 proprietary proprietary 7440-22-4 7440-31-5 7440-50-8 n/a n/a
EZAIRO 7160 SL E7160-0-102A57-AG Active  Y   Download xls Download xml Download xml Download xml  8   5   1   25   1   60   31.761657   100   9.487651   100   0.6612   19.2173913   0.501449275   6.231884058   2.005797101   6.405797101   38.43478261   4.637681159   22.56521739   4.29   0.00709093   0.006120203   3.060102E-5   0.419825588   0.666538183   47.07153539   1.265362377   11.46358402   0.504217339   0.072076018   0.086461268   5.073998354   1.081122235   0.060222058   18.26346295   3.804880297   0.100837274   0.302833076   2.234161478   0.100993279   0.51860259   9.3603E-5   2.18407E-4   3.12E-6   0.51860259   2.55304553   3.821023659   25.15949216   4   4   2   3   86   1   2.64   74.00000016 
EZAIRO 7160 SL E7160-0-102A57-BPG Active  Y   Download xls Download xml Download xml Download xml  8   5   1   25   1   60   31.761657   100   9.487651   100   0.6612   19.2173913   0.501449275   6.231884058   2.005797101   6.405797101   38.43478261   4.637681159   22.56521739   4.29   0.00709093   0.006120203   3.060102E-5   0.419825588   0.666538183   47.07153539   1.265362377   11.46358402   0.504217339   0.072076018   0.086461268   5.073998354   1.081122235   0.060222058   18.26346295   3.804880297   0.100837274   0.302833076   2.234161478   0.100993279   0.51860259   9.3603E-5   2.18407E-4   3.12E-6   0.51860259   2.55304553   3.821023659   25.15949216   4   4   2   3   86   1   2.64   74.00000016 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.
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