ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `*  `  `` f*  f  f` f* *     *       `f* ff* fa* a* * *    (    (              !+   *!  (!/       (       + * *     *  (      (   !+  !  !+  !  ! `AP0101AT2L00XPGA0-DRZR3 A@@    ;(RDƵ 2/11/2025 Base PartAP0101ATHFPb-freeOrderable PartAP0101AT2L00XPGA0-DRTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5Die Attach Epoxy$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6 Filler (SiO2) 68909-20-613-Methacryloxypropyltrimethoxysilane (C10H20O5Si) 2530-85-0Silica Amorphous (SiO2) 7631-86-9Ortho-Cresol Novolac Resin 29690-82-2Mold Compound-Black Epoxy resinPhenolic ResinCarbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5 Copper (Cu) 7440-50-8Substrate and Solder MaskTalc 14807-96-6 Epoxy Resin 26875-67-2Barium Sulfate (BaSO4) 7727-43-7Substrate Copper FoilSubstrate - Core MaterialFiber Glass (SiO2) 65997-17-3Substrate Plating-Au Gold (Au) 7440-57-5Substrate Plating-CuSubstrate Plating-Ni Nickel (Ni) 7440-02-0Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFJ #o&rX\,   )"$  dMbP?_*+%"d,,??U} @} 9 } } }  )      [ NNN P \+ / / Q fg h ij(\UP@ ]    S ^@@  T(\? _>  Tףp= X@ `?  T? ^@p= ף?  T? _>  TD@ _>   T? _>   T2@ `?   TD@ ^  @ ףp=@@ !  T@ _> "  T@ _> # $T333333? `? % &T̬V@ ^'@%@ ( )T@ _> * +T X@ `? , -T? ^.@(\? / 0T @ _> 1 2TN@ _>  T? _>  T@ `? 3 4T?@ a5Gq= ףp? , -TY@ ^6@Gz!@ ! TQ5@ `? 7 8TQS@ a9GGz? : ;TY@ a<Gp= ף@ , -TY@ a=G? > ?TY@ a@G(\? : ;TY@ bB!(\UP@ !!UD l,BFFN<<N<<<<N<<<N<<N<<<<NN<NNNN !"#$%&'( c V!c!V"c"V#c#V$c$V%c%V&c&V'dIIIWP(e:3/pub/Collateral/BRD8022-D.PDFBg(YYYZT<(  ~  <NUP@5%   ]4@   < Halogen Free< ~~  <@1        '(( Root EntryWorkbook)