ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `*  `  `` f*  f  f` f* *     *       `f* ff* fa* a* * *    (    (              !+   *!  (!/       (       + * *     *  (      (   !+  !  !+  !  ! ` AP0102AT2L00XPGA0-DRZR3 A@@    ;.^MƵ 2/11/2025 Base PartAP0102ATHFPb-freeOrderable PartAP0102AT2L00XPGA0-DRTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5 Die AttachSiloxanes and Silicones, di-Me, hydroxy-terminated, reaction products with Me hydrogen siloxanes and trimethoxy(3- (oxiranylmethoxy)propyl)silane 153890-18-7*1,1'-(Methylenedi-p-phenylene)bismaleimide 13676-54-5B2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin copolymer acrylate 55818-57-0+2,2-dimethyl-1,3-propanediyl dimethacrylate 1985-51-92-phenoxy ethyl acrylate 48145-04-6Epoxy Phenol Novolak Resin 28064-14-4Mold Compound-Black Epoxy resinPhenolic ResinCarbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5 Copper (Cu) 7440-50-8 SubstrateBoehmit (Al(OH)O) 1318-23-6Fiber Glass (SiO2) 65997-17-3Silica Amorphous (SiO2) 7631-86-9 Polycarbonite80-05-7Bismaleimide Triazine resinSubstrate and Solder MaskTalc 14807-96-6 Epoxy Resin 26875-67-2Barium Sulfate (BaSO4) 7727-43-7Substrate Copper FoilSubstrate Plating-Au Gold (Au) 7440-57-5Substrate Plating-CuSubstrate Plating-Ni Nickel (Ni) 7440-02-0Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFR #o|\vFa   /#'  dMbP?_*+%"d,,??U} @} 9 } W} }  /      [ NNN P \+ / / Q fg h ij(\V@ ]    S ^@)\(!@  T(\? _>  Tףp= X@ `?  T? ^@?  T4@ _>  TF@ _>   T$@ _>   T$@ _>   T$@ `?  ! T@ ^" @ ףp=@@ #  T@ _> $ T@ _> % &T333333? `? ' (T̬V@ ^)@%@ * +T@ _> , -T X@ `? . /T? ^0@4@ # Tffffff-@ _> 1 2T>@ _> 3 4T7@ _> 5 6T? _>  T!@ _> 7 8T? `? 9 T4@ ^:@ףp= @ ; <T @ _> = >TN@ _> 5 6T? _>  T@ `? ? @T?@Dv l,BFFN<<N<<<<<N<<<N<<N<<<<<<N<<< !"#$%&'()*+,-. aA GRQ!@ . / TY@ !aB!GzG? !C !D!TY@ "aE"G? ". "/"TY@ #aF#GzG @ #G #H#TY@ $aI$Gffffff? $C $D$TY@ %bK%!(\V@ %!!U&c&V'c'V(c(V)c)V*c*V+c+V,c,V-dIIIWP.e:3/pub/Collateral/BRD8022-D.PDFBg.YYYZ"NNNNN0T<(  ~  <NUP@5%   ]4@   < Halogen Free< ~~  <@1          !!!!!!!!""""""""########$$$$$$$$%-.. Root EntryWorkbook<,