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WeightDieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5 Die AttachСSiloxanes and Silicones, di-Me, hydroxy-terminated, reaction products with Me hydrogen siloxanes and trimethoxy(3- (oxiranylmethoxy)propyl)silane 153890-18-7*1,1'-(Methylenedi-p-phenylene)bismaleimide 13676-54-5B2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin copolymer acrylate 55818-57-0+2,2-dimethyl-1,3-propanediyl dimethacrylate 1985-51-92-phenoxy ethyl acrylate 48145-04-6Epoxy Phenol Novolak Resin 28064-14-4EpoxyImidazole Addition 68490-66-4$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6Zirconium Dioxide (ZrO2) 1314-23-4Silica Amorphous (SiO2) 7631-86-9Formaldehyde Polymer 9003-36-5 Imaging LensTitanium Dioxide (TiO2) 13463-67-7Sodium Monoxide (Na2O) 1313-59-3Boron Trioxide (B2O3) 1303-86-2Zinc Monoxide (ZnO) 1314-13-2Aluminum Trioxide (Al2O3) 1344-28-1Potassium Monoxide (K2O) 12136-45-7Silica Crystalline (SiO2) 14808-60-7 Mold Compound!Hexahydromethylphthalic anhydride 25550-51-0$1,6-Bis(2,3-epoxypropoxy)naphthalene 27610-48-6Fused Silica (SiO2) 60676-86-0 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5 Copper (Cu) 7440-50-8 Solder Mask Epoxy resinTalc 14807-96-6Carbon Black (C) 1333-86-4Barium Sulfate (BaSO4) 7727-43-7Substrate Copper FoilSubstrate - Core MaterialFiber Glass (SiO2) 65997-17-3Substrate Plating-Au Gold (Au) 7440-57-5Substrate Plating-CuSubstrate Plating-Ni Nickel (Ni) 7440-02-0Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF j┬ 'qЩуТ▄А╩#mо°AЛ·Di│╥p║h ╗ ╠┴ 7d%8,  d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } ыW} р} ╤ 7                                     ¤ [╛ NNN¤ P¤ \+¤ /¤ /¤ Q¤ fg¤ h¤ ijЄ╥Mb└f@¤ ] ¤  ¤  ¤  ¤ S ¤ ^@ffffff2@¤ ¤ TR╕ЕыQ╪?╛ _>¤ ¤ T╕ЕыQиX@╛ `?¤ ¤ TоGсzоя?¤ ^@ ╫гp= ї?¤ ¤ T4@╛ _>¤ ¤ TАF@╛ _>¤ ¤  T$@╛ _>¤ ¤  T$@╛ _>¤ ¤  T$@╛ `?¤  ¤ ! 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