ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `* `f* ff* fa* a* * *    `  `` f*  f` f* *     *      f    (    (              !+   *!  (!/       (       + * * *      (      (   !+  !  !+  !  ! ` -ARRAYRDM-0112A20-QFN-TR1ZR3 A@@    ;(NHƵ 2/11/2025 Base PartARRAYRDM-0112A20-QFNPb-freeOrderable PartARRAYRDM-0112A20-QFN-TR1Total weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3Glass Attach Epoxy;4-Thiophenyl phenyl diphenyl sulfonium hexafluoroantimonate 71449-78-03,4-EPOXYCYCLOHEXYLMETHYL 2386-87-0 Imaging LensTitanium Dioxide (TiO2) 13463-67-7Sodium Monoxide (Na2O) 1313-59-3Boron Trioxide (B2O3) 1303-86-2Zinc Monoxide (ZnO) 1314-13-2Antimony Trioxide (Sb2O3) 1309-64-4Aluminum Trioxide (Al2O3) 1344-28-1Potassium Monoxide (K2O) 12136-45-7Silica Crystalline (SiO2) 14808-60-7 Laminate Tape Epoxy resinproprietary data Phenol ResinAcrylic CopolymerFused Silica (SiO2) 60676-86-0 Lead Frame Zinc (Zn) 7440-66-6 Iron (Fe) 7439-89-6 Copper (Cu) 7440-50-8Phosphorus (P) 7723-14-0Mold Compound-BlackCarbon Black (C) 1333-86-4Ortho-Cresol Novolac Resin 29690-82-2Phenolic Resin (Novolac) 9003-35-4PlatingPalladium (Pd) 7440-05-3 Nickel (Ni) 7440-02-0 Gold (Au) 7440-57-5Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFJ FuPea   )"$  dMbP?_*+%"d,,??U} @} 9 } [%} }  )      [ NNN P \+ // Q fg h ij9vn@ ]    S ^ :}?5^;@  TY@ _EbX9?  T? `D  TX@ _Ev7@  T@ aG  T@ aG   T@ aG   T@ aG   T? aG  ! T@ aG " # T@ `D $ %T`Q@ _&E}?5^ ;@ ' (T$@ aG ) (T$@ aG * (TQ@ `D + ,T$@ _-ElR@ . /TQ? aG 0 1T@ aG 2 3T`X@ `D 4 5TQ? _6EX9vV@ 7 8T? aG + ,TV@ aG 9 :T@ `D ; <T@ _=EQ? > ?T)\(@ aG @ AT(\W@ `D B CTQ? ^D:%C? B CTY@ bF!9vn@ !!UD l,>FFNN<N<<<<<<<N<<<N<<<N<<<N<<N !"#$%&'( c V!c!V"c"V#c#V$c$V%c%V&c&V'dIIIWP(e:3/pub/Collateral/BRD8022-D.PDFBg(YYYZ(  ~  <@*%'(( Root EntryWorkbook'