ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `*  `  `` f*  f  f` f* *     *       `f* ff* fa* a* * *    (    (              !+   *!  (!/       (       + * *     *  (      (   !+  !  !+  !  ! `E8310-0-101A49-BPGZR3 A@@    ;8mUƵ 2/11/2025 Base Part EZAIRO 8310HFPb-freeOrderable PartE8310-0-101A49-BPGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. Weight CapacitorSilicon Dioxide 7631-86-9Titanium Dioxide (TiO2) 13463-67-7Boron Trioxide (B2O3) 1303-86-2Tin (Sn) 7440-31-5Misc.proprietary dataBarium Monoxide (BaO) 1304-28-5 Nickel (Ni) 7440-02-0 Copper (Cu) 7440-50-8Die Silicon (Si) 7440-21-3Laminate Board Lead Compoundn/aOrganic CompoundOrganic Acid SaltInorganic Acid Salt Glass Cloth 65997-17-3 D.I. Water 7732-18-5 copper foilOrganic FillerGold Potassium Cyanide 13967-50-5Thermosetting resinAntifoamer and Leveling agentOrganic pigmentPhthalocyanine blue147-14-8Talc 14807-96-6 Zinc (Zn) 7440-66-6Silica Amorphous (SiO2) Chromium (Cr) 7440-47-3Cured Resin of Solder MaskBarium Sulfate (BaSO4) 7727-43-7Mold Compound-Black Epoxy resin Phenol ResinMetal HydroxideCarbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0 Solder Paste2-(2-Hexyloxyethoxy) ethanol112-59-4"Denatured Acid Hydrogenation Rosin proprietary Dimer Acid Silver (Ag) 7440-22-4Wire Bond - Au Gold (Au) 7440-57-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFZ "ph X ['u    9#I*  dMbP?_*+%"d,,??U} @} 9 } 7} }  9      [ NNN P \+ / / Q fg h ijF;nE@ ]    S ^@!rh?  T_Cz9? _>  Tc4@ _>  T059? _>  T܄e]@ _>  TtY.@ _>   T5cD@ _>   Tu~@ `?   T>R4@ a Gu+@  ! TY@ ^" @KY8@ # $ T ^)p? _> % T= ףp=? _> & $T/$? _> ' $T(\@ _> ( )TS,@ _> * +T%C $@ _> , $Tioe,@ _> - $T)\(? _> . /T@ _> 0 TB93@ _> 1 TM? _> 2 TL7A`? _> 3 4TL7A`? _> 5 6TʡE? _> 7 8Tnt? _> 9 T)\(? _> : ;Ta2U0*S? _>  Ta2U0*c? _> < Tv+@D@ l,BFFN<<<<<<<NN<<<<<<<<<<<<<<<<< !"#$%&'()*+,-./012345678 _>   T!lV}(@ !`? != !>!THzG@ "^?"@>@ "@ ""T @ #_> #A ##T@ $_> $B $$T? %_> %9 %%T9@ &_> &C &D&T? '`? 'E 'F'TN@ (^G(@!uq? (H (I(T@ )_> )J )K)T@ *_> *L *K*T@ +_> +M +N+T@ ,_> , ,,TU@ -`? - --T? .aO.G(? .P .Q.TY@ /bS/!F;nE@ /!!U0c0V1c1V2c2V3c3V4c4V5c5V6c6V7dIIIWP8e:3/pub/Collateral/BRD8022-D.PDFBg8YYYZ6<<N<<<<<N<<<<<N0T<(  ~  <NUP@5%   ]4@   < Halogen Free< ~~  <@       ! ! ! !"'"'"'"'(-(-(-(-......../788 Root EntryWorkbook .