╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р ╕`└ р ╕``└ р╕f* р ╕f└ р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р╕* р ╕└ р ╕└ р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `Е ╦GBU6KМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;№ш1-║ь╠╥╩╙╞╡ 2/12/2025 Base PartGBU6KHFOrderable PartTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3Die Attach Solder Silver (Ag) 7440-22-4 Lead (Pb) 7439-92-1Tin (Sn) 7440-31-5 Lead Frame Iron (Fe) 7439-89-6 Copper (Cu) 7440-50-8Phosphorus (P) 7723-14-0Mold Compound-Black Epoxy resinproprietary dataPhenolic ResinCarbon Black (C) 1333-86-4Fused Silica (SiO2) 60676-86-0Phenolic Resin (Novolac) 9003-35-4Silica Crystalline (SiO2) 14808-60-7PlatingTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF 2▒ uЙфыFe└√V ╗ ╠┴ э  d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } ∙} р} ╤                                  ¤ [╛ NNN¤ P¤ \+¤ /¤ /Q¤ fg¤ h¤ ij ╫гp}6п@¤ ]¤ ¤  ¤  ¤ S ¤ ^ :.@¤  ¤ TY@¤ _G═╠╠╠╠ .@¤ ¤ T@╛ `E¤ ¤ T W@╛ aF¤ ¤ T@¤ _GfffffЬ@¤ ¤ T333333├?╛ `E¤ ¤  T33333єX@╛ aF¤ ¤  TЪЩЩЩЩЩй?¤ _ Gра@¤ ¤  TЪЩЩЩЩЩ @╛ `E¤  ¤  TЪЩЩЩЩЩ @╛ `E¤ !¤ " T333333у?╛ `E¤ #¤ $T.@╛ `E¤ %¤ &T@╛ aF¤ '¤ (TАQ@¤ ^):{оGсz@¤ ¤ TY@¤ b+! ╫гp}6п@╛ !!UcVcVcVcVcVcVcV╛dIIIWPe:3/pub/Collateral/BRD8022-D.PDFBg╛YYYZ╫<■,>FFNN<<N<<N<<<<<N0ь╬Ё╬ЁЁ╢Ё( Ё   ЁЁ~в Ё г Ё<А╕NUЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢ < Halogen Free<  >╢@х╩                                                                                                                                                                                                                                                                                                                                                                                                Root Entry        ■   Workbook            Й                          ■   ■   ■