╨╧рб▒с;■  ■   ■                                                                                                                                                                                                                                                                                                                                                                                                                                                    ╙╠Aс░┴т\pwwwadmin B░a=Ьп╝=h\:╛#8X@Н"╖┌1╚ РArial1╚ РArial1╚ РArial1╚ РArial1 ╝Arial1╚ ╝Arial1а ╝Arial1а РArial1┤ РArial1М РArial1а РArial1а ╝Arial1╚ РArial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)рї  └ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ рї  Ї└ р └ р+ї  °└ р)ї  °└ р,ї  °└ р*ї  °└ р ї  °└ р  р + р  р () р*8 р└ р* р (8/ р  () р (└ р (└ р ╕ р ╕└ р ╕ р ╕ р ╕ р ╕└ р ╕ р ╕ р ╕+ р ╕└ р ╕+ р ╕└ р ╕+ р ╕+ р ╕+ р ╕+ р ╕ р ╕ р╕* р╕`* р╕`f* р╕ff* р╕fa* р╕a* р╕* р╕* р ╕└ р ╕`└ р ╕``└ р╕f* р ╕f`└ р╕f* р╕* р ╕└ р ╕└ р╕* р ╕└ р ╕└ р ╕f└ р ╕└ р (╕└ р ╕└ р (╕└ р ╕└ р ╕└ р ╕ р ╕└ р ╕ р ╕  р ╕!+ р ╕  р*╕! р (╕!/ р ╕ └ р ╕ └ р ╕ └ р (╕ └ р ╕ └ р ╕ └ р ╕ р ╕+ р*╕ р╕* р╕* р ╕└ р ╕└ р (╕└ р ╕└ р ╕└ р (╕ └ р ╕!+ р ╕!└ р ╕!+ р ╕! р ╕ ! УА УА УА УА УА УА `ЕsNB7NPQ1102MMTTWGМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;№};7║ь╠╥╩╙╞╡ 2/11/2025 Base Part NB7NPQ1102MHFPb-freeOrderable PartNB7NPQ1102MMTTWGTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3 Die Attach Silver (Ag) 7440-22-4Acrylic resinsproprietary data Lead Frame Zinc (Zn) 7440-66-6 Iron (Fe) 7439-89-6 Copper (Cu) 7440-50-8Phosphorus (P) 7723-14-0Mold Compound-Black Epoxy resins 129915-35-1Silica Amorphous (SiO2) 7631-86-9Carbon Black (C) 1333-86-4Aluminum Hydroxide (Al(OH)3) 21645-51-2Fused Silica (SiO2) 60676-86-0Phenolic Resin (Novolac) 9003-35-4PlatingTin (Sn) 7440-31-5 Wire BondPalladium (Pd) 7440-05-3 Gold (Au) 7440-57-5TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDF :╝ nЧчWx╚V}═ ╗ ╠┴  ы  d№йё╥MbP?_*+ВА% Б┴ГДб"d,,р?р?U} @} 9 } 8} р} ╤                                       ¤ [╛ NNN¤ P¤ \+¤ /¤ /¤ Q¤ fg¤ h¤ ijR╕ЕыQ>@¤ ] ¤  ¤  ¤  ¤ S ¤ ^:оGсzоч?¤ ¤ TY@¤ _E ╫гp= ╟?¤ ¤ T@U@╛ `D¤ ¤ T.@¤ _EсzоG!0@¤ ¤ T@╛ aG¤ ¤ T╕ЕыQ╕╛?╛ aG¤ ¤  T═╠╠╠╠╠@╛ aG¤ ¤  TрW@╛ `D¤ ¤  T╕ЕыQ╕Ю?¤ _ E{оGс·(@¤  ¤ ! T@╛ aG¤ "¤ # T@╛ aG¤ $¤ %TЪЩЩЩЩЩ┘?╛ aG¤ &¤ 'Tffffff@╛ aG¤ (¤ )T@U@╛ `D¤ *¤ +Tffffff@¤ ^,:П┬ї(\Пт?¤ -¤ .TY@¤ _/EЪЩЩЩЩЩ╔?¤ 0¤ 1T@╛ aG¤ 2¤ 3Tр?╛ `D¤ ¤ T`X@¤ b5!R╕ЕыQ>@╛ !!UcVcVcVcVcVcVcV╛dIIIWPe:3/pub/Collateral/BRD8022-D.PDFBg╛YYYZ╫DT l,BFFNN<N<<<<N<<<<<NN<<0ь╬ЁTЁЁ<Ё( Ё   ЁЁ~в Ё г Ё<А╕NUЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢ < Halogen Free< ь~Ё~в Ё г Ё<А<╛R└ЕЗБP┐└@╦5%╬ ┐ Ё  Ё]4@ ь Ё╢<Lead Free and ROHS Compliant<   >╢@хъ                                                         Root Entry        ■   Workbook            ╨#                         ■   ■   ■