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Silicon Photomultipliers (SiPM) | ARRAYC

Silicon Photomultiplier Arrays, C-Series (SiPM)

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Overview

4-Side Scalable Arrays of C-Series SiPM Sensors:

ON Semiconductor's C-Series silicon photomultiplier (SiPM) sensors are used to create compact and scalable arrays. The MLP-packaged sensors are mounted onto PCB boards with minimal dead space and are available in a variety of formats, formed of sensors of either 1 mm, 3 mm or 6 mm. The back of each ArrayC has either multi-way connectors or a ball grid array (BGA), to give access to the fast* and standard outputs, and a common I/O from the summed substrates of the pixels.

* Note that the ARRAYC-60035-4P-BGA does not have fast outputs.

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • 4-Side scalable arrays
  • Variety of formats ranging from 2×2 to 12×12
  • Minimal deadspace at the edges allowing tiling on all sides to allow the creation to still larger detection areas
  • Each array has either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual C-Series sensors
  • Optional evaluation boards for are available for easy access to signals

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ARRAYC-30035-144P-PCB

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CAD Model

Pb

A

H

P

ARRAYC-300XX-144P-PCB

100DE

1

260

UNTBX

1

Y

Array

12 x 12

3 mm x 3 mm

35

420

41

30

Price N/A

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ARRAYC-30035-16P-PCB

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CAD Model

Pb

A

H

P

ARRAYC-300XX-16P-PCB

100DF

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

35

420

41

30

Price N/A

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ARRAYC-60035-4P-BGA

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CAD Model

Pb

A

H

P

ARRAYC-600XX-4P-BGA

100DG

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

41

30

Price N/A

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ARRAYC-60035-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYC-600XX-64P-PCB

100DH

1

260

UNTBX

1

Y

Array

8 x 8

6 mm x 6 mm

35

420

41

30

Price N/A

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Reliability Data

Die Related Summary Data

Device: ARRAYC-30035-144P-PCB

Equivalent to wafer fab process: CMOS SUB

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

CMOS SUB

2

920154574

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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